PECVD and ICP-RIE Systems
University of Wisconsin-Madison > Purchasing Services Department
Original Solicitation Links
2027-UWMSN-01480-RFB
]pecvd & icp-rie systems for the nanoscale fabrication center
Contact
Submission Instructions
Description
The University of Wisconsin-Madison is purchasing one plasma-enhanced chemical vapor deposition (PECVD) system and one inductively coupled plasma reactive ion etching (ICP-RIE) system for a nanoscale fabrication cleanroom. The systems will replace existing tools and must support semiconductor wafer processing, specified deposition and etching capabilities, optical endpoint spectroscopy, software control and data logging, safety interlocks, U.S. NRTL certification, and compatibility with the stated facility utilities. The bid price must include FOB-destination delivery, installation, commissioning, setup, instruction, manuals, drawings, training, packing, freight, insurance, and related transportation costs. The bidder must be the original manufacturer or an authorized distributor/dealer with service and repair capabilities and must have provided the requested items or services for at least five years. A minimum two-year warranty covering parts, labor, and travel is required, with warranty repairs addressed on site within three weeks of initial contact. The University may require product demonstrations, presentations, or site visits before award, and acceptance testing will occur during commissioning.
Classification Codes
Smart Codes
Specifications
Timeline
Requirements
- Workers Compensation
- Commercial Liability, Bodily Injury, and Property Damage — $1,000,000.00
- Automobile Liability and Property Damage — $1,000,000.00
- Minimum 3 references
- Within the last 3 years
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