High-Volume Microelectronics Sourcing

The U.S. Army Contracting Command is seeking capability statements from original component manufacturers and Tier-1 distributors able to supply high-volume commercial, industrial, and defense-grade microelectronics for circuit card assembly integration.

United States of America > DEPT OF DEFENSE > DEPT OF THE ARMY > W0ML USA DEP TOBYHANNA


General
Open (active)
MicroelectronicsSourcingforTYAD2
Oct 27, 2026 05:00 PM
Oct 08, 2026 12:59 PM
Request for Information (RFI)
Federal
Ask AI about this solicitation
Original Solicitation Links
Contact
mark.buonomo2.civ@army.mil
+15706159781
Description

The U.S. Army Contracting Command is conducting market research to identify qualified original component manufacturers and Tier-1 direct distributors capable of supplying commercial-off-the-shelf, industrial, and defense-grade microelectronics in sustained, large-scale production volumes for circuit card assembly integration. Representative requirements include multilayer ceramic capacitors, precision and current-sense resistors, power-management and regulation components, power MOSFETs and discrete diodes, microcontrollers and digital integrated circuits, inductors, and high-reliability interconnects. Respondents must describe production capacity, lead times, allocation policies, domestic and offshore assembly, packaging and testing locations, supply-chain traceability, certificates of conformance, quality systems, buffer-stock or vendor-managed-inventory capabilities, and anti-counterfeiting controls. Capability statements must be searchable PDFs of no more than five pages, excluding the cover page and product-specification appendices, using 12-point font and one-inch margins; proprietary information must be marked on each applicable page. The response should also state interest in and preferred format for a potential industry/vendor day.

Classification Codes
NAICS334413Semiconductor and Related Device Manufacturing
PSC5962Microcircuits, Electronic
Smart Codes
microelectronics supplysemiconductor componentselectronic component distribution
Specifications
Supply Only
No
Timeline
Oct 08, 2026 12:59 PM-Published Date
Oct 27, 2026 05:00 PM-Response Deadline
Nov 11, 2026-Inactive Date
Requirements
No
Documents
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