Purchase of Silicon-Based Photonics Integrated Circuits for AstroPIC Project Laboratory Testing
NATIONAL AERONAUTICS AND SPACE ADMINISTRATION
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Description
NASA/NSSC requires the manufacture of silicon-based photonics integrated circuit (PIC) devices for laboratory testing as part of the AstroPIC project at NASA Ames Research Center. These PICs will feature input grating coupler designs manufactured to specific tolerances using electron-beam lithography with full and partial etch capabilities. The devices are intended for high-contrast imaging demonstrations for coronagraphy. Applied Nanotools (ANT) will deliver a total of 56 PIC devices, referred to as 'dies', based on NASA-provided silicon photonic layout design files. The specifications for these devices include Silicon-on-Insulator (SOI) material, partial etch (layer 2) with 70nm (+-10nm) depth, full etch (layer 1) at 220nm depth, and oxide cladding of 2.2+/-0.2 microns. Applicable devices will also include tri-layer metallization for thermal phase shifters and deep trench processes for thermal isolation, with TiW and Au layers on 5 wafers total. Devices containing Micro-Electro-Mechanical Systems (MEMS) structures will have direct metallization, via openings, and MEMS release. The fabricated photonics integrated circuits will be delivered to NASA Ames Research Center, Building N255 Central Receiving, Moffett Field, CA 94035, United States, Attention: Dan Sirbu. Delivery is expected approximately 16 weeks after receipt of order.
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Documents
| Title | Date Posted |
|---|---|
| SATPC0041470 Tab 04 4 SOW.pdf | Jun 16, 2026 12:00 PM |
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