Secure Microelectronics and Advanced Packaging Market Research
United States of America > DEPT OF DEFENSE > DEPT OF THE ARMY
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This Request for Information is for market research and planning only, not a solicitation or offer for a binding contract. The Government is seeking information from domestic products, suppliers, designers, manufacturers, and vendor teams regarding secure packaged microelectronic components, printed circuit boards, and supporting technologies for current and future military systems. Areas of interest include board-level security for modular open systems architectures; secure packaging for multi-chip modules and systems-in-package; enhanced secure-boot soft intellectual property; purpose-designed secure chiplets and application-specific integrated circuits; multi-chip packaging; and emerging materials, processes, and technologies that improve security of packaged microelectronics. Respondents should describe technical capabilities, technology readiness, domestic manufacturing compatibility, operational performance, prior related efforts, data and intellectual-property rights, rough-order-of-magnitude costs, licensing, development schedules, and go-to-market considerations. Responses are limited to 10 pages excluding the cover page, must use at least 11-point font and one-inch margins, and must be submitted as PDFs through the PIEE Solicitation Module.
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Documents
| Title | Date Posted |
|---|---|
| R2.0_SS_RFI_SUBMISSION_v1.2.pdf | Aug 17, 2026 12:00 PM |
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