Dopant-Selective Deep Reactive Ion Etching of 4H-SiC Wafers

NASA's Johnson Space Center procurement office is seeking capability statements from vendors able to perform dopant-selective deep reactive ion etching on two 4-inch 4H-SiC wafers to create precision diaphragms; quotes are not being requested.

United States of America > 8000


General
Open (active)
80NSSC27946811Q
Oct 16, 2026 08:00 PM
Oct 13, 2026 08:21 PM
Sources Sought
Federal
Ask AI about this solicitation
Original Solicitation Links
Contact
lindsey.m.mclellan@nasa.gov
1 Stennis Space Center, Hancock County, MS, USA
Description

NASA/NSSC is conducting a special notice and requesting capability statements for dopant-selective deep reactive ion etching of two 4-inch, approximately 350-micron-thick single-crystal 4H-SiC wafers. The wafers are already electroplated with patterned nickel etch masks. The work requires etching to a depth of 320 microns to create approximately 30-micron-thick diaphragms with radii ranging from 300 to 900 microns. The resulting diaphragms must meet specified quality requirements, including thickness uniformity within ±5% across each wafer, smooth sidewalls without scalloping, no unacceptable trenching or notching, fewer than five micro-mask artifacts per etched diaphragm surface where reasonably achievable, and an aspect ratio of at least 5. The etch recipe for semi-insulating and n-type SiC selectivity is to be determined by the foundry or customer. This notice is for capability statements only; submitted quotes will not be evaluated. The notice states an intent to pursue a sole-source contract with Biotronics Inc., subject to the Government's determination whether competition is warranted.

Classification Codes
NAICS334413Semiconductor and Related Device Manufacturing
PSC5961Semiconductor Devices and Associated Hardware
Smart Codes
reactive ion etchingsilicon carbide waferssemiconductor fabrication
Specifications
Service Only
Timeline
Oct 13, 2026 07:21 PM-Published Date
Oct 16, 2026 08:00 PM-Capability Statement Response Deadline
Oct 31, 2026-Inactive Date
Documents
TitleDate Posted
SATPC0043009 Tab 07 Capability Statement.pdfOct 13, 2026 12:00 PM
SATPC0043009 TAB 04 4 SOW.pdfOct 13, 2026 12:00 PM
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