High Throughput Wafer Scale Manufacturing of Custom Achromatic Infrared Meta Optics

The U.S. Army is seeking a cost-effective, high-throughput manufacturing process for wafer-scale achromatic infrared meta-optics using high-index, IR-transparent materials for MWIR and LWIR bands.

United States of America > DEPT OF DEFENSE > DEPT OF THE ARMY


General
Open
26.TZ
Sep 23, 2026 12:00 PM
Aug 26, 2026 12:00 PM
Request for Proposal (RFP)
Federal
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Submission Instructions
Description

The U.S. Army is soliciting proposals for a cost-effective, high-throughput manufacturing process to produce wafer-scale achromatic meta-optic components for infrared (IR) systems. These components are flat surfaces made of subwavelength-scale meta-units that can replace bulky, multi-element curved optics, reducing size, weight, and complexity in IR systems such as portable vision devices, UAV surveillance platforms, and wearable electronics. The process must be compatible with standard semiconductor fabrication infrastructure and use high-index, IR-transparent materials optimized for both mid-wave infrared (MWIR) and long-wave infrared (LWIR) bands. The goal is to overcome current bottlenecks in throughput, alignment, tooling cost, and material compatibility that limit existing fabrication methods like electron beam lithography, UV immersion lithography, nanoimprint lithography, grayscale lithography, and deep UV projection lithography.

Classification Codes
NAICS334413Semiconductor and Related Device Manufacturing
PSCAE31MANUFACTURING TECHNOLOGY - BASIC RESEARCH
Smart Codes
wafer-scale meta-optics manufacturinginfrared optics fabricationsemiconductor lithography processes
Specifications
Service Only
Timeline
Aug 5, 2026-Release Date
Aug 26, 2026-Open Date
Sep 23, 2026-Close Date
Documents
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