APxF Rev K3 PCB Assembly and Reflow
University of Wisconsin-Madison > Purchasing Services Department > Department of Physics
Original Solicitation Links
2027-UWMSN-01465-RFB
]apxf rev k3 assembly and reflow
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Submission Instructions
Description
The University of Wisconsin-Madison is seeking a vendor to assemble and solder-reflow 99 APxF Rev K3 printed circuit boards in three setups. The University will provide the boards and component kits, which may arrive in multiple shipments; the vendor must process the parts, bake components as necessary, use a lead-free jet-printing solder process, and perform assembly and inspection to IPC Class 3 standards. The boards include mixed through-hole and surface-mount components on both sides, heavy copper, blind and plated-through vias, fine-pitch components, and large BGAs. The work is expected to occur in phased runs approximately two months apart. The vendor must support rework related to its work, return unused parts in good condition, provide evidence of comparable assembly capability upon request, and have a reflow oven with at least 10 zones and a nitrogen atmosphere. Final assembly and testing will be performed by the University. Bidders must submit a technical proposal or sufficiently detailed quotation, including setup charges, programming NRE, delivery terms, experience, warranty/service coverage, country of origin, shipping point, importer-of-record information, and tariff treatment. The solicitation requires electronic submission through the ShopUW+ Sourcing Module and requires completion of the Vendor Information Form and other online certifications/forms, including DOA-3027 if proprietary information is claimed.
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Join TeamsRequirements
- Workers Compensation
- Commercial liability, bodily injury and property damage, including products liability and completed operations — $1,000,000.00
- Automobile liability and property damage — $1,000,000.00
- Minimum 3 references
- Within the last 3 years
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