Atomic Layer Deposition System
University of Missouri System
Original Solicitation Links
27-0052
]atomic layer deposition system
Request for Bid-27-0052
]atomic layer deposition system
Contact
Submission Instructions
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Description
The University of Missouri System is soliciting bids for one atomic layer deposition system for use in undergraduate semiconductor engineering courses in a new cleanroom. The system must support thermal ALD and remote plasma PEALD, accommodate coupon pieces from 1 cm x 1 cm through 6-inch wafers, and include a loadlock, six precursor sources, heated precursor bubblers and delivery lines, a pump and foreline, and the specified process gases and oxidants. Requested initial process recipes include Al2O3, HfO2, SiO2, TiO2, TiN, and AlN; the preferred wafer-temperature range is room temperature to 400degC or higher. The bid requests detailed system literature and pricing, with optional line items for software/hardware, maintenance or service, training, installation, shipping/freight, and a discount. The system must include a 24-month warranty. Award is based on the lowest bid price meeting specifications.
Classification Codes
Smart Codes
Specifications
Timeline
Requirements
Location
Documents
| Title | Date Posted |
|---|---|
| Bid Invitation | Oct 21, 2026 12:00 AM |
| Solicitation Terms and Conditions 01-26-26.pdf | Oct 21, 2026 12:01 AM |
| Instructions to Respondents 8.28.26.pdf | Oct 21, 2026 12:01 AM |
| Legal Ad | - |
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