Plasma-Enhanced Chemical Vapor Deposition System
University of Missouri System
Original Solicitation Links
Request for Bid-27-0044
]plasma enhanced chemical vapor deposition (pecvd) system
Contact
Submission Instructions
Description
The University of Missouri is seeking one plasma-enhanced chemical vapor deposition (PECVD) system for Missouri S&T's Semiconductor Engineering bachelor's degree program and new cleanroom. The system must process substrates from 1 cm x 1 cm pieces through six-inch wafers; deposit silicon dioxide and silicon nitride films; include a vacuum load-lock, temperature-controlled substrate and upper electrode, chiller, reactor-body heating, 300 W RF generator, LF generator for stress control, corrosive-gas-resistant dry foreline and turbomolecular pumps, six mass-flow-controller process-gas lines, and endpoint detection. The system must include a 24-month warranty. The bid includes separate pricing lines for the PECVD system, optional software/hardware, maintenance or service agreement, training, installation, shipping/freight, and discounts. Respondents must provide detailed system literature and, if pricing a maintenance or service agreement, literature describing the service terms. Award will be based on the lowest bid price meeting all specifications. Responses must be submitted through the University of Missouri System's electronic bidding platform.
Classification Codes
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Specifications
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Requirements
Location
Documents
| Title | Date Posted |
|---|---|
| Legal Ad | - |
| Solicitation Terms and Conditions 01-26-26.pdf | Oct 07, 2026 06:00 PM |
| Bid Invitation | Oct 07, 2026 06:00 PM |
| Instructions to Respondents 8.28.26.pdf | Oct 07, 2026 06:00 PM |
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